SMIP - Sistemi Microelettronici in Package

The main aim of the project is to address the new technological challenges arising from SiP innovation, all while considering a supply chain perspective. Thus, the project aims, through a case study structure, to study devices based on SiP technology. All necessary processes that are relevant to the design, development and validation phases of both devices and components - along the entire supply chain - will be examined. Adding to this, the project strives to introduce, where possible, materials that improve the overall ecological footprint of the devices.