System-in-Package Wireless Solution for Wearable Alert Button

As electronics miniaturization advances, the concept of System in Package (SiP) has become essential. SiP is a level of integration where multiple bare die devices and passive components are interconnected on the same package. This technology enables the creation of small devices used in various fields such as automotive, aerospace, medicine and wearable devices.This work aims at developing a wearable alert device in the form of a button made of a fixed part and a removable part. In case of danger, the user can open the button, enabling the transmission of a message to a mobile device via Bluetooth. For the creation of the final device, the first phase involved selecting the components needed for the application. Next, the PCB design was created, printed and the components were soldered onto it. The PCB was then placed into a container designed to facilitate the opening of the button.