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Interfacing Technologies for Edge Microsystems

Jan 2026-Dec 2029

SiCPIC- Silicon Carbide Photonic Integrated Circuit

Research Funded Project and Doctoral Network
Horizon Europe and MSCA

The project aims to overcome the limitations of current microelectronic circuits by exploring the unique optical properties of Silicon Carbide (SiC). This wide band-gap semiconductor is a promising material that can address the challenges of high-power consumption and signal delay in existing technologies.

A core component of this project is the training of 15 Doctoral Candidates in the field of PIC technologies. These researchers will gain a wide range of skills, from materials and device design to system-level applications, with the goal of creating a platform solution that ensures European leadership in next-generation PIC technologies. This training is crucial for implementing the EU Chips Act and ensuring a greater degree of European semiconductor autonomy.

PARTNERS
Technical University of Denmark (DTU) - Department of Electrical and Photonics Engineering (coordinator), Friedrich-Alexander-Universitaet Erlangen-Nuernberg, Centre National de la Recherche Scientifique CNRS, Istituto Nazionale di Ricerca Metrologica, Swiss PIC, Genauigkeits Maschinenbau Nurnberg GmbH, Freiberg Instruments GmbH, SPEA, Ignis Photonyx A/S, Neoplas Control GmbH, Corial SAS, and Université Grenoble Alpes.
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Chilab-ITEM is part of MP4MNT and is the reference research laboratory for Polytechnic University of Turin for the study of microsystems packaging.
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