The SMIP (Sistemi Microelettronici in Package) project officially launched on Friday, January 24th with a kick-off meeting at the SPEA headquarters in Volpiano. Funded by the Piedmont Region's Swich program, this 30-month research project will bring together partners to develop two case studies based on SiP technologies. The project aims to advance microelectronic systems by focusing on innovative packaging solutions, leveraging the diverse expertise of its partners to achieve significant advancements in the field.
SMIP brings together five companies, SPEA, Asseltech, Cemas Elettra, Mista and Electronica, and three Universities, UniUPO (DISIT, DISSTE), UniTo and PoliTo (DISAT, DIGEP, DIMEAS, DENERG).
