SiCinSiP

The project aims to conduct a supply-chain-wide study of all the technological and manufacturing steps required to implement new power modules based on wide-bandgap semiconductors (SiC and GaN) created with System in Package (SiP) architecture to support the Energy Transition. This objective entails technological challenges to be solved by all stakeholders involved in the supply chain, ranging from the study of materials and their performance, to testing, assembly, and module integration processes along the value chain, up to application case studies in sectors such as automotive. Demonstrator components will be developed to validate the correct functioning of the processes.