System-in-Package (SiP) co-design in the electronics industry involves an integrated approach to designing and optimizing all components of a system within a comprehensive package. Not only the individual parts and their interconnections are considered, but also the surrounding mechanical and thermal environment. Finite Element Method (FEM) simulation plays a crucial role in this process. The virtual model of a SiP can be employed to accurately predict and analyze various device behaviors like stress, strain, temperature distribution, vibration. This allows for early identification and mitigation of potential issues like component failures, signal integrity degradation, and thermal hotspots. FEM simulation enables iterative design refinement and optimization, leading to more robust, reliable, and efficient SiPs, ultimately accelerating time-to-market and reducing development costs.

Electronic devices at micro and millimeter scales are crucial today, with their performance and functions depending on their internal components. The electronics field is now focused on smaller, more heterogeneous integrated devices, which is due to the growing interest in System-in-Package (SiP). The encapsulation of elements like passive and active components, MEMS, and optical elements within a package is important for device communication and protection. The materials used for both packaging and internal components, such as metals, polymers, and ceramics, are essential for the device functionality, reliability, and thermal stability. SiP combines different chips with various functions in one system. Achieving this requires developing new fabrication processes and integration strategies, shifting from traditional manufacturing to innovative methods like additive electronics.

The efficiency and operation of a System in Package (SiP) device is investigated through specific protocols and procedures. This step is generally defined as thermal, morphological and opto-electronic characterization of innovative prototypes. The research in this topic aims to evaluate the packaging ability to protect modules from external agents, by analysing thermal dissipation and the level of integration with system components. Characterization techniques will use advanced instruments such as a climate chamber, a digital microscope, a profilometer, and a thermal conductivity test machine. At the same time, the operation of the prototype must be assessed, thanks to electrical or optic characterization. The ultimate goal is to provide a complete evaluation of the performance and reliability of advanced packaging prototypes, focusing on increasing thermal dissipation, miniaturization, and device reliability.