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Interfacing Technologies for Edge Microsystems
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3D-lumped Cauer Thermal Model of a Power Module
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Heat Pipe Integration in High Power Ceramic Substrates
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Sputtering Deposition and Characterisation of Lead-Free Alloys micro-Bumbs for Flip-Chip Technology
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Design of Probe heads for testing power devices (MOSFET)
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Power semiconductor devices contact resistance
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Interconnections and packaging for power electronics
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System in Package modelling
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Laser Microwelding
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AI Techniques for the Optimisation of DBC Substrates for High Power Systems-in-Package (HPSiP)
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AI techniques for the optimization of highly integrated power modules
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Chilab-ITEM is part of MP4MNT and is the reference research laboratory for Polytechnic University of Turin for the
study of microsystems packaging.
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